Thermal conductive phase change silicone pad

Short Description:

It is an insulating pad which is based on polyimide film and mixed low melting ceramic filling, it has the properties of high dielectric constant and high thermal conductivity. At the temperature of 50 ℃, the surface begins to be soft and start flowing, filling the irregular gap on the contact surface between the heating element and the heat sink to reduce the thermal resistance.

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Product Detail

Product Tags

Features

* Good Thermal Conductivity
* Electrically Isolating
* Natural tacky
* Easy to assembly

Applications

* Computer services: CPU, Heat sink, Memory modules
* LED Lighting, LCD-TV
* Military Electronics
* Power Supplies
* Wireless instruments
* Automotive control services

Payment Features

Item	Unit	TS805K	TS806K	TS808K	Test Method
Color		Light Amber			Visual
Thermal conductivity	W/m.k	1.6			ASTM D5470
Thickness	mm	0.127	0.152	0.203	ASTM D374
PI film thickness	mm	0.025	0.025	0.05	ASTM D374
Specific weight	g/cc	2.0			ASTM D297
Tensile strength	Kpsi	>13.5	>13.5	>13.5	ASTM D412
Temperature range	℃	-50~130			/
Phase change temperature	℃	50	50	50	/
Dielectric strength	VAC	>4000	>4000	>5000	ASTM D149
Dielectric constant	MHz	1.8			ASTM D150
Volume Resistance	Ohm-meter	3.5*10^14			ASTM D257
Thermal impedance	℃-in2/W	0.12	0.13	0.16	ASTM D5470